Texas Instruments Long Term Debt 2010-2023 | TXN

Texas Instruments long term debt from 2010 to 2023. Long term debt can be defined as the sum of all long term debt fields.
  • Texas Instruments long term debt for the quarter ending December 31, 2023 was $10.624B, a 29.01% increase year-over-year.
  • Texas Instruments long term debt for 2023 was $10.624B, a 29.01% increase from 2022.
  • Texas Instruments long term debt for 2022 was $8.235B, a 13.73% increase from 2021.
  • Texas Instruments long term debt for 2021 was $7.241B, a 15.89% increase from 2020.
Texas Instruments Annual Long Term Debt
(Millions of US $)
2023 $10,624
2022 $8,235
2021 $7,241
2020 $6,248
2019 $5,303
2018 $4,319
2017 $3,577
2016 $2,978
2015 $3,120
2014 $3,630
2013 $4,158
2012 $4,186
2011 $4,211
2010 $
2009 $
Texas Instruments Quarterly Long Term Debt
(Millions of US $)
2023-12-31 $10,624
2023-09-30 $10,922
2023-06-30 $10,920
2023-03-31 $9,626
2022-12-31 $8,235
2022-09-30 $7,438
2022-06-30 $6,745
2022-03-31 $7,242
2021-12-31 $7,241
2021-09-30 $7,239
2021-06-30 $5,752
2021-03-31 $6,250
2020-12-31 $6,248
2020-09-30 $6,247
2020-06-30 $6,245
2020-03-31 $5,499
2019-12-31 $5,303
2019-09-30 $5,302
2019-06-30 $4,558
2019-03-31 $5,057
2018-12-31 $4,319
2018-09-30 $4,318
2018-06-30 $5,066
2018-03-31 $3,578
2017-12-31 $3,577
2017-09-30 $3,084
2017-06-30 $3,084
2017-03-31 $2,980
2016-12-31 $2,978
2016-09-30 $2,977
2016-06-30 $2,975
2016-03-31 $2,869
2015-12-31 $3,120
2015-09-30 $3,132
2015-06-30 $3,134
2015-03-31 $3,638
2014-12-31 $3,630
2014-09-30 $3,643
2014-06-30 $4,394
2014-03-31 $4,652
2013-12-31 $4,158
2013-09-30 $4,161
2013-06-30 $4,165
2013-03-31 $4,183
2012-12-31 $4,186
2012-09-30 $4,190
2012-06-30 $2,703
2012-03-31 $4,207
2011-12-31 $4,211
2011-09-30 $4,215
2011-06-30 $3,498
2011-03-31
2010-12-31
2010-09-30
2010-06-30
2010-03-31
2009-12-31
2009-09-30
2009-06-30
2009-03-31
Sector Industry Market Cap Revenue
Computer and Technology Semiconductor - General $162.894B $17.519B
Texas Instruments, Inc. is an original equipment manufacturer of analog, mixed signal and digital signal processing (DSP) integrated circuits. TI has manufacturing and design facilities, including wafer fabrication and assembly/test operations in North America, Asia and Europe. Management's strategy has been to build assets that would be fully utilized through their lifetimes and outsource any excess demand in peak situations to outside foundries. Analog products have been categorized into three: high performance analog, high volume analog and logic, and power management. The Embedded Processing segment includes TI's OMAP, connectivity solutions, non-wireless DSPs and microprocessors. The Other segment includes smaller semiconductor product lines, such as DLP products, RISC microprocessors and ASICs, calculators and other schoolroom tools, and royalties. The company's products are sold in industrial, personal electronics, automotive, communications, enterprise and other end-markets.
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